BGA PREHEATER

TEKLAB introducing PRE-HEATER for BGA REWORK System. It comes with Temperature controlled system with 460 W upto120 ℃ ~ 250 ℃

FEATURES

• Rapid heating, only 10s to reach 250 ℃. 
• Built-in temperature sensor, stable output temperature.
• Cool or hot air can be selected to pre-heat or cool chips.
• The Pre-heater can be used with rework stations to process BGA or other flake ICs.
• Fixture for B.G.A Re-Work System which can hold PCBs for B.G.A Re-work.
• M.D Re-workstations/Systems can be connected at the top and Pre-Heater can be placed below the PCB.
• Vacuum Pickup can be used to pickup/hold the components.